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Advanced Semiconductor Process Platform
NDL integrated device remote service platform  

 
 
 
 
 
 
 
 

Three kinds of integration service platforms will be opened and those actual charges as below:
Contact window: Jin-Long Song / Tung-Yen Lai, TEL: +886-3-5726100 ext.7653/7575

Process Service Platform Charge NT$ (each batch ) Description
NEMS/MEMS Device Integration Platform
(Application for actuator and sensor components development)
  • One piece: forty thousand
  • Two pieces: fifty thousand
  • Three pieces: sixty thousand
  • ….n pieces: [4+1*(n-1)] ten thousand
  • Twelve pieces: fifteen hundred
※ Base on NDL standard process
    steps
※ not include the wafer charge
※ Twelve pieces limited for one
    stepsbatch (CMP criteria)
※ MEMS mask must provide with
    stepstheir own
Planar Device Integration service platform
(Aapplication for new materials and process technology service platform Verification of device)
  • Within five pieces:(one hundred thousand)
  • Six pieces: one hundred and four thousand
  • Seven pieces: one hundred and eight thousand
  • …n pieces: 10+0.4*(n-5) ten thousand
  • Twenty pieces: sixty thousand
※ Base on NDL standard process
    steps
※ not include the wafer charge
※ Twenty pieces limited for one
    batch (control wafer
    consideration)
Non-planar Device Integration service platform
(Apllication for FinFET,GAA NW,TFET deices related research)  
  • One piece: eighty thousand
  • Two pieces: one hundred and twenty thousand
  • Three pieces: sixty thousand
  • …n pieces: 8+0.4*(n-1) ten thousand
  • Six pieces: Two hundred and eighty thousand
※ Base on NDL standard process
    steps
※ not include the wafer charge
※ Six pieces limited for one batch
    (e-beam criteria)
※ Exposure time < 2hr./wafer