• Hsin-chu site Fee
  • Tainan site Fee
  • Metrology Analysis Service Fee
  • High Frequency Technology Fee
  • Hsin-chu site
  • Tainan site
  • Metrology Analysis Service
  • High Frequency Technology
  1. Self- operation Process for Academia: 90% discount
     
  2. Foundry Services for Academia (includingacademia sinica): 90% discount, but the cost of materials 100% charge
     
  3. Self- operation Process for Industry: no open
     
  4. Foundry Services for Industry:Please refer to the following table
     
 
service Fee Table

 
No.  Name of Equipment  Self-operation  Foundry Service 
 
Instrument Starting fee
(NT/ each case)
Service fee
Instrument Starting fee
(NT/each case)
Operation fee
(NT/min.)
Academia 
(NT/min.)
Industry
(NT/ hr.) 
CF-L02A Mask Fabrication Services not provided  0 217
NT/min.
433
(NT/min.)
Mask Fabrication Services Mask layout-check not provided  0 900
NT/hr.
900
(NT/hr.)
Mask layout-modification not provided  0 1,300
NT/hr.
1,300
(NT/hr.)
Extra materials fee – quartz mask not provided  4,000
NT/piece
Extra materials fee-glass mask not provided  1,000
NT/piece
CF-L02W 6" Leica e-beam system 0 167 0 217 26,000
CF-L05 6" I-line stepper 0 200 30,000
(Industry)
250 27,500
CF-L06 6" In-line SEM 0 1
NT/sec.
20,000
(industry)
178 13,200
CF-L09 6" Track Mark 8 0 2
NT/sec.
20,000
(Industry)
203 14,150
CF-L12 6" ELS7500 e-beam system 0 35 20,000
(industry)
52 6,000
CF-L13 6" FIB Operation service not provided  0 4,500
NT/hr.
7,000
TEM sample preparation not provided  0 10,500
/sample
15,000
/sample
CF-L14 6" Nanoimprint 0 0.5
NT/sec.
not provided 
CF-L16 8" S9260A In-line SEM not provided  0 223 223
(NT/min.)
CF-L17 8" Track ACT8 not provided  0 244 244
(NT/min.)
CF-L18 8" FEB   not provided  0 405 405
(NT/min.)
TEM Sample preparation not provided  0 12,500
NT/hr.
17,000
/sample
CF-L19 8" Shaped e-beam system not provided  0 474 474
(NT/min.)
CF-T12 6" Spin Coater (Low-k) 0 0.1 
NT/sec.
0 360
NT/hr.
360
CF-C01 6" CMP 0 73 1,000 106 6,940
CF-C02 6" Post CMP cleaner 0 25 1,000 76 4,550
CF-C05 6" Wet Bench (front end) Pre-furnace -H2SO4 0 60 0 89 6,100
6" Wet Bench (front end) Pre-furnace -HCL 0 60 0 89 6,100
6" Wet Bench (front end) Pre-furnace -DHF 0 60 0 89 6,100
6" Wet Bench (front end) Pre-furnace -NH4OH 0 60 0 89 6,100
6" Wet Bench (front end) Photoresist-H2SO4 #1 0 60 0 89 6,100
6" Wet Bench (front end) Photoresist -H2SO4 #2 0 60 0 89 6,100
6" Wet Bench (front end) Photoresist B.O.E.7:1 0 60 0 89 6,100
6" Wet Bench (front end) Photoresist - Metal P.R.Stripping 0 60 0 89 7,250
6" Wet Bench (front end) H3PO4(8吋) 0 60 0 89 6,100
6" Wet Bench (front end) B.O.E.7:1 (8吋) 0 60 0 89 6,100
CF-C06 6" Wet Bench (back end) H2SO4 0 60 0 89 6,100
6" Wet Bench (back end) B.O.E.7:1 0 60 0 89 6,100
CF-C08 8" CMP Academia:
1,500
industry:
4,000
(Not open to operation,  OEM only)
83 Academia:
1,500
industry:
5,000
133  

  1. Self- operation Process for Academia: 90% discount
     
  2. Foundry Services for Academia (includingacademia sinica): 90% discount, but the cost of materials 100% charge
     
  3. Self- operation Process for Industry: no open
     
  4. Foundry Services for Industry:Please refer to the following table
     
 
service Fee Table

 
No. Name of Equipment Instrument Operation OEM Service
Instrument Starting fee (NT$/each case) Service fee
Instrument Starting fee
(NT$/each case)
Operation fee
(NT$/min.)
Academic Institutions
(NT$/min.)
Industry
(NT$/hr.)
SE-001 Plasma Enhanced Chemical Vapour Deposition(PECVD) & Inductively Coupled Plasma (ICP) Etcher 0 50 1,000 58 6,000
SE-002 Reactive ion etching system (STS)  0 17 0 42 5,500
SE-003 Sputter  0 22 0 38 2,800
SE-004 Metal gauge  0 34 1,000 50 3,080
SE-005 Four point probe  0 0.1
NT$/sec.
0   not provided 
SE-006 Scanning Electron Microscopy ; SEM 0 19 0 40 2,500
SE-007 Film thickness measurement(n&k analyzer) 0 0.3
NT$/sec.
0 1,500
NT$/hr.
1,500
SE-008 Wet Bench – RCA Cleaning 0 20 0 54 3,500
SE-009 Auto PR Coating machine (Track) 0 35 20,000 46 11,500
SE-010 Mask alignerMA150CC 0 50 20,000 50 14,000
SE-011 RF Sputter  0 13 0 not provided   
SE-012 Horizontal Furnace(Wet / Dry Oxidation)  0 15 0 29 6,000
SE-012 Horizontal Furnace(Amorphous / Polysilicon)  0 30 0 29 10,000
SE-012 Horizontal Furnace(Annealing)  0 15 0 29 6,000
SE-013 Wet Etching Chemical Hood 0 18 0 not provided   
SE-014 Manual Photo resist Spin Coater 0 5 0 not provided   
SE-015 Wafer bonding  0 0.15
NT$/sec.
0 not provided   
SE-016 Thermal coater 0 11 0 36 3,500
SE-017 Mask aligner MJB3 0 6 0 not provided   
SE-018 原子力顯微鏡系統(AFM) 0 5 0 not provided   
SE-019 Profile meter 0 17 1,000 33 2,000
SE-020 Ion sputter (Gold target) 0 0.2
NT$/sec.
0 not provided   
SE-021 HWCVD  0 30 0 38 38
NT/min.
SE-022 Semi-Automatic Cu Electroplating 0 0.97
NT$/sec.
0 3,450
NT$/hr.
3,450
SE-C01 Solar simulator and IV measurement system 0 15 0 24 5,000
SE-C02 Incident Photon Conversion Efficiency Overview (IPCE) 0 27 0 43 3,500
SE-C03 NMs Surface Modification and Coating Bench overview 0 0.1
NT$/sec.
0 not provided   
SE-C04 UV-VIS-NIR Spectrophotometer 0 20 0 36 2,340
SE-C05 photoluminescence 0 20 0 37 2,340
SE-C06 Direct-current measurement system (IVCV) 0 7 600 55 3,400
SE-C07 高頻S參數量測設備(HP8510C) 0 0.22
NT$/sec.
0 not provided   
SE-C08 Electron Beam &Thermal Evaporation  Deposition  System 0 40 0 50 50
NT$/min.
SE-C10 MBRAUN UNILab Plus Glove Box Workstation & Organometallic vapor deposition system 0 21 0 29 29
NT$/min.
SE-C11 Rapid Thermal Annealing ; RTA 0 17 0 25 25
NT$/min.
SE-C12 X-ray fluorescence  spectrometry 0 23 0 40 40
NT$/min.
SE-C13 Radio Frequency Sputter ; RF Sputter 0 30 0 40 40
NT$/min.
Remark: OEM commissioned Hours less than half-hour(30 minutes) will be counted by a half-hour. 
No. Name of Equipment Self-operation Fee (NT$/ sec.) Foundry Service Fee (NT$/hr.) Remark
NM-001 Filed Emission Scanning Electron Microscopy (FESEM) 0.4 --  
NM-002 Atomic Force Microscopy (AFM) (8”Wafer) 0.45 3,000  
NM-004 Auger Electron Spectroscopy (AES) -- 5,455  
NM-005 Ion Miller 0.1 --   
NM-006 Transmission Electron Microscopy (TEM) 1.5 10,800  
NM-007 Conductive Atom Force Microscopy (CAFM) 0.6 AFM Function 3,000  
C AFM Function 4,000  
NM-008 X-ray Diffractometer (XRD) 0.6 2,500  
NM-009 Thermal Filed Emission Scanning Electron Microscopy (TFSEM) 0.6 3,500  
NM-010 Sample preparation 0.2 Silicon process Plane view 10,000 (NT$/piece)  
Cross-section 15,000 (NT$/piece)
Sapphire
process
Plane view 10,000 (NT$/piece)
Cross-section 15,000 (NT$/piece)
NM-013 Secondary Ion Mass Spectroscopy (SIMS) -- Academia 5,000 (NT$/hr.) 2 hours per unit
Industry 11,000 (NT$/unit)
NM-014 Scanning Probe Microscopy (D3100) 32 (NT$/ min.) AFM Function 3,000  
SCM Function 4,000  
NM-015 X-ray Photoelectron Spectroscopy (XPS) -- 7,200  
No. Name of Equipment Self-operation Fee
(NT$ / sec.)
Foundry Service Fee
(NT$ / hr.)
Remark
HF-001 Nano Device Parameter Measurement System 0.36 5,000 NT$5,000
Non-standardmeasurement will be charged extra for thecost of materials.
HF-003 50GHz S-parameter Measurement System 0.7 5,500
HF-004 High Frequency Noise Parameter Measurement System 1-18 GHz 0.84 6,000
18-65 GHz not provided  7,000
HF-005 High Frequency Power Parameter Measurement System 0.98 6,500
HF-006 High-Frequency Circuit Measurement System Below 67 GHz 0.98 6,000
Above 67 GHz not provided  7,000
HF-007 Low Frequency Noise Measurement System 0.28 4,000
HF-009 110 GHz S-Parameter Measurement System not provided  7,000
HF-010 Nonlinear Vector Network Analysis Measurement System not provided  7,000
HF-011 IV&CV Electrical Measurement System 0.2 not open  
HF-012 Power Device Measurement System not provided  85
(NT$ / min.)
 
HF-013 Millimeter-wave Noise/Power Parameter Measurement System not provided  120
(NT$ / min.)
 
HF-014 220 GHz S-Parameter Measurement System not provided  120
(NT$ / min.)
 
Remark: OEM commissioned Hours less than half-hour(30 minutes) will be counted by a half-hour.
Remark: OEM commissioned Hours might be counted more half-hour to 2 hours depends on standard calibration or waveguide patterns setup.
Lithography and Mask Fabrication Equipment
No.  Name of Equipment  Contact Window  Ext. Indroduction level
C01 6" CMP management-
Ming-Chih Lai
Proxy-
Ming-Chih Lai
7687
7716
C1-A B2
C02 6" Post CMP cleaner Responsible-
Ming-Chih Lai
Proxy-
Ming-Chih Lai
7687
7716
C2-A B2
C05 6" Wet Bench (front end) management-
Shin-Yi Peng
Proxy-
Simon Peng
7714
7606
C5-A B1
C06 6" Wet Bench (back end) management-
Simon Peng
Proxy-
Shin-Yi Peng
7606
7714
C6-A B1
C08 8”CMP management-
Jui-Min Liu
Proxy-
Ming-Chih Lai
Proxy-
Hsiao-Pai Chiang
7716
7687
7579
C8-A B4
C09 8" Wet Bench (back end) management-
Simon Peng
Proxy-
Shin-Yi Peng
7606
7714
C9-A B4
C10 8" Wet Bench (front end) management-
Shin-Yi Peng
Proxy-
Simon Peng
7714
7606
C10A B4
L02A Mask Fabrication Services management-
Ying-Lin Hung
Proxy-
Shih-Che Chen
7746
7647
L2A-A B4
L02W 6" Leica e-beam system management-
Andy Liu
Proxy-
Tony Cheng
7649
7644
L2W-A B3
L05 6" I-line stepper management-
Chin-Tsai Hsu
Proxy-
Chun Chi Chen
7648
7695
L5-A B3
L06 6" In-line SEM management-
Shih-Che Chen
Proxy-
Chin-Tsai Hsu
7647
7648
L6-A B2
L09 6" Track Mark 8 management-
Chao-Sin Hong
Proxy-
Tony Cheng
7438
7644
L9-A B1
L12 6" ELS7500 e-beam system management-
Shih-Che Chen
Proxy-
Andy Liu
7647
7649
L12A B3
L13 6" FIB management-
Mei-yi Li
Proxy-
Chun-Chi Chen
7652
7695
L13A B4
L14 6" Nanoimprint management-
Chao-Sin Hong
Proxy-
Chun-Chi Chen
7573
7695
L14A B1
L16 8" S9260A In-line SEM management-
Chin-Tsai Hsu
Proxy-
Tony Cheng
7648
7644
L16A B4
L17 8" Track ACT8 management-
Tony Cheng
Proxy-
Chao-Sin Hong
7644
7573
L17A B4
L18 8" FEB management-
Chun-Chi Chen
Proxy-
Meiyi Li
7695
7652
L18A B4
L19 8" Shaped e-beam system management-
Tony Cheng
Proxy-
Andy Liu
7644
7649
L19A B4
M07 Contact angle system management-
Hsiao-Pai Chiang
Proxy-
Simon Peng
7579
7606
M7-A B1
M09 N & K analyzer 1200 management-
Yu-Sheng Lai

Proxy-
Hsiao-Pai Chiang
check-
Mao-Qugn Wei
7532
7579
7510
M9-A B1
M13 Stress Measurement System management-
Meiyi Li
Proxy-
Jui-Min Liu

check-
Mao-Qugn Wei
7652
7716
7510
M13A B2
M16 FTIR management-
Yu-Sheng Lai
Proxy-
Hsiao-Pai Chiang
7532
7579
M16A B1
M18 UV–VIS Spectrophotometer management-
Hsiao-Pai Chiang
Proxy-
Simon Peng
7579
7606
M18A B1
M19 Metal 4 point probe management-
Hsiao-Pai Chiang
Proxy-
Ming-Chih Lai
check-
Mao-Qugn Wei
7579
7687
7510
M19A B1
M20 Adhesion tester management-
Simon Peng
Proxy-
Shin-Yi Peng
7606
7714
M20A B1
M23 N & K analyzer 1500 management-
Yu-Sheng Lai
Proxy-
Hsiao-Pai Chiang
check-
Mao-Qugn Wei
7532
7579
7510
M23A B1
M24 Topcon Surfscan management-
Shin-Yi Peng
Proxy-
Simon Peng
check-
Mao-Qugn Wei
7714
7606
7510
M24A B2
M25 Ellipsometer M2000 management-
Jui-Min Liu
Proxy-
Hsiao-Pai Chiang
check-
Mao-Qugn Wei
7716
7579
7510
M25A B2
M28 Wyko - White Light Interferometer management-
Yu-Sheng Lai
Proxy-
Ho-Min Chang
7532
7747
M28A B3
T12 6" Spin Coater (Low-k) management-
Chao-Sin Hong
Proxy-
Shih Che Chen
7573
7647
T12A B1
R514 Chemistry Lab management-
Hsiao-Pai Chiang
Proxy-
Simon Peng
7579
7606
R514-A B1

Etch and Thin Film Fabrication Equipment
No   Name of Instrument   Contact Window   Ext.  Indroduction   level
E01 TCP poly etcher Cho-Lun Hsu 7651 E1-A B2
E02 TEL oxide etcher Alan Hsu 7537 E2-A B1
E04 Ozone asher Ta-Wei Wu 7638 E4-A B1
E06 P-10 surface profiler Bo-Hao Chu 7554 E6-A B1
E07 Mattson ASPEN Asher Ta-Wei Wu 7638 E7-A B1
E08 TCP9600 CF-E08 Nelson Hsueh 7557 E8-A B2
E09 ICP Etcher Hsu Cho-Lun 7651 E9-A B2
E10 LAM 2300 FEOL etcher-8  Nelson Hsueh 7557 E10-A B4
E11 LAM 2300 BEOL etcher-8  Hsu Cho-Lun 7651 E11-A B4
E12 Multi-function BEOL etcher  Wen-Cheng Chiu 7569 E12-A --
M11 Laser Marker Eason Huang 7582 M11-A B4
M26 TXRF  Amy Liu 7661 M26-A B1
S01 JETFIRST RTP Ta-Wei Wu 7638 S1-A B2
S02 KORONA RTP 800 Ta-Wei Wu 7638 S2-A B3
S04 AG-610 Ta-Wei Wu 7638 S4-A B2
S05 iStar 12" YUAN-CHEN LIAO 7583 S5-A B4
儀器設備
新進機台成果
 


注意事項:『委託操作申請』請至對外服務系統

No.

Name of Equipment 

Contact Window 

Ext.

Indroduction

level

Location

SE-001

Plasma Enhanced Chemical Vapour Deposition(PECVD) & Inductively Coupled Plasma

Han-Ting Hsueh/Garfield Chen

6605/6609

B2

5F
R5202

SE-002

Reactive ion etching system (STS) 

Lai-fu Tsai/Garfield Chen

6625/6609

B2

5F
R5202

SE-003

Sputter 

Lai-fu Tsai/Garfield Chen

6625/6609

B2

5F
R5202

SE-004

Metal gauge 

Han-Ting Hsueh/Lai-fu Tsai

6605/6625

B2

5F
R5202

SE-005

Four point probe 

Lai-fu Tsai/Yen-Hsi Li

6625/6629

B1

5F
R5202

SE-006

Scanning Electron Microscopy ; SEM 

Yen-Hsi Li/Yuan-Fu Tang

6629/6624

B2

1F
R1301

SE-007

Film thickness measurement(n&k analyzer)

Yuan-Fu Tang/Lai-fu Tsai

6624/6625

B2

5F
R5202

SE-008

Wet Bench – RCA Cleaning

Yen-Hsi Li/Yuan-Fu Tang

6629/6624

B2

5F
R5202

SE-009

Auto PR Coating machine (Track)

Yuan-Fu Tang/Lai-fu Tsai

6624/6625

B2

5F
R5202

SE-010

Mask alignerMA150CC

Yuan-Fu Tang/Lai-fu Tsai

6624/6625

B2

5F
R5202

SE-011

RF Sputter 

Lai-fu Tsai/Yen-Hsi Li

6625/6629

B1

5F
R5202

SE-012

Horizontal Furnace(Wet / Dry Oxidation

Lai-fu Tsai/Garfield Chen

6625/6609

B2

5F
R5202

SE-013

Wet Etching Chemical Hood

Yen-Hsi Li/Yuan-Fu Tang

6629/6624

B1

5F
R5202

SE-014

Manual Photo resist Spin Coater

Yuan-Fu Tang/Lai-fu Tsai

6624/6625

B1

5F
R5202

SE-015

Wafer bonding 

Lai-fu Tsai/Garfield Chen

6625/6609

B1

5F
R5202

SE-016

Thermal coater

Garfield Chen

6624/6609

B2

5F
R5202

SE-017

Mask aligner MJB3

Yuan-Fu Tang/Lai-fu Tsai

6624/6625

B1

5F
R5202

SE-019

Profile meter

Yuan-Fu Tang/Lai-fu Tsai

6624/6625

B2

5F
R5202

SE-020

Ion sputter (Gold target)

Yen-Hsi Li/Yuan-Fu Tang

6629/6624

B1

1F
R1301

SE-021

HWCVD

Lai-fu Tsai/Yuan-Fu Tang

6625/6624

B2

5F
R5202

SE-022

Semi-Automatic Cu Electroplating

Han-Ting Hsueh/Yuan-Fu Tang

6605/6624

B1

5F
R5202

SE-C01

Solar simulator and IV measurement system

Yu-Jen Hsiao/Tzu-Ying Chen

06-2082408
8712/8703

B2

* 

SE-C02

Incident Photon Conversion Efficiency Overview (IPCE)

Yu-Jen Hsiao/Tzu-Ying Chen

06-2082408
8712/8703

B2

 

* 

SE-C03

NMs Surface Modification and Coating Bench overview

Tzu-Ying Chen/Yu-Jen Hsiao

06-2082408
8703/8712

B1

* 

 

SE-C04

UV-VIS-NIR Spectrophotometer

Yu-Jen Hsiao/Tzu-Ying Chen

06-2082408
8712/8703

B2

 

* 

SE-C05

photoluminescence

Yu-Jen Hsiao/Tzu-Ying Chen

06-2082408
8712/8703

B2

 

* 

SE-C06

Direct-current measurement system (IVCV)

Yu-Jen Hsiao/Tzu-Ying Chen

06-2082408
8712/8703

B2

* 

SE-C08

Electron Beam &Thermal Evaporation  Deposition  System

Yen-Hsi Li/Tzu-Ying Chen

06-2082408
8716/8703

B2

* 

SE-C10

MBRAUN UNILab Plus Glove Box Workstation & Organometallic vapor deposition system

Yen-Hsi Li/Yu-Jen Hsiao

06-2082408
8716/8712

B2

* 

 

SE-C11

Rapid Thermal Annealing ; RTA

Yen-Hsi Li/Tzu-Ying Chen

06-2082408
8716/8703

B2

* 

SE-C12

X-ray fluorescence  spectrometry

Tzu-Ying Chen/Yu-Jen Hsiao

06-2082408
8703/8712

B2

*

SE-C13

Radio Frequency Sputter ; RF Sputter

Yen-Hsi Li/Yu-Jen Hsiao

06-2082408
8716/8712

B2

*

NO. Name of Equipment Contact Window Extension no. level Location Introduction Notice
NM-001 Filed Emission Scanning Electron Microscopy (FESEM)  Chiung-Chih Hsu 7751/7424
B2
R221
NM-002 Atomic Force Microscopy (AFM)(8”Wafer) Yi-Ling Jian 7577/7424
B2
R221
NM-004 Auger Electron Spectroscopy (AES)  Yi-Ling Shen 7552/7423
B4
R215
NM-005 Ion Miller  Chien-Ting Wu Ph.D. 7682/7408
B2
R203
NM-006 Transmission Electron Microscopy (TEM)  Chien-Ting Wu Ph.D. 7682/7408
B3
R229
NM-007 Conductive Atomic Force Microscopy (C-AFM)  Tung-Huan Chou 7553/7424
B2
R221
NM-008 X-ray Diffractmeter (XRD)  Jie-Yi Yao 7681/7409
B2
R204
NM-009 Thermal Field Emission Scanning Electron Microscopy (TFSEM)  Chiung-Chih Hsu 7751/7423
B2
R215
NM-010 Sample Preparation Chien-Ting Wu Ph.D. 7682/7408
B2
R203
--
--
NM-013 Secondary Ion Mass Spectroscopy (SIMS)  Mei-Ling kuo 7780/7423
B4
R215
NM-014 Scanning Probe Microscopy(D3100)  Yi-Ling Jian 7577/7424
B4
R212
NM-015 X-ray Photoelectron Spectroscopy (XPS) Yi-Ling Shen 7552/7423
B4
R215
NM-016 Micro-FTIR Jhong-Yan Yang 7726/7424
B2
R221

No. Equipment English name Indroduction Contact Window  level Location Layout Rule Quility Forms
HF-001 Nano Device Parameter Measurement System Bo-Yuan Chen
7570,7607
B2 R438 http://cs.ndl.narl.
org.tw/
security/login.aspx
 
HF-003 50GHz S-parameter Measurement System Yu-Ming Teng
7633,7607
B2 R438
HF-004 High Frequency Noise Parameter Measurement System Wen-Der Liu
7576,7607
B2 R438
HF-005 High Frequency Power Parameter Measurement System Chia-Wei Chuang
7574,7607
B2 R432
HF-006 High-Frequency Circuit Measurement System Jung-Yen Liao
7686,7607
B2 R438
HF-007 Low Frequency Noise Measurement System Bo Yuan Chen
7570,7607
B2 R438
HF-009 110 GHz S-Parameter Measurement System Yu-Ming Teng
7633,7607
B4 R432
HF-010 Nonlinear Vector Network Analysis Measurement System Chia-Wei Chuang
7574,7607
B4 R432
HF-011 IV&CV Electrical Measurement System Wen-Der Liu
7576,7607
B1 R431
HF-012 Power Device Measurement System Bo-Yuan Chen
7570,7607
B4 R431-B
HF-013 Millimeter-wave Noise/Power Parameter Measurement System Wen-Der Liu
7576,7607
B4 R432
HF-014 220 GHz S-Parameter Measurement System Yu-Ming Teng
7633,7607
B4 R434